Electronic Packaging Reliability of Compact Lead-Free Products and Design-for-Manufacturability of Optoelectronic Modules

Program
Fulbright U.S. Scholar Program
Program Country
Grant Activity Type
Lecturer, Research
Discipline
Academic Year
Dates
-
Flex
No
Scholar type
U.S. Scholar
Project Title
Electronic Packaging Reliability of Compact Lead-Free Products and Design-for-Manufacturability of Optoelectronic Modules

Scholar Information

Grantee
Luu Nguyen
Title
Other
Host Institutions